chip mounting apparatus, cleaning head, and method for manufacturing semiconductor device

• Main Authors: SAITO AKIRA, IKARASHI ITSUKI
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention provides a chip mounting apparatus, a cleaning head, and a method for manufacturing a semiconductor device capable of suppressing diffusion of foreign matter and cleaning the surface of a substrate. A chip bonding apparatus includes: a transfer section for transferring a substrate on which a chip is to be mounted in a first direction; a cleaning head including a first nozzle, a second nozzle, and a suction aperture; and a drive section that moves the cleaning head in a second direction. The suction aperture first and second sides extend in the first direction in a planar view, and is disposed between blowout openings of the first nozzle and the second nozzle. The blowout opening of the first nozzle extends along the first side of the suction aperture in a planar view, and perpendicularly to a surface of the substrate. The blowout opening of the second nozzle extends along the second side of the suction aperture in a planar view, and aslant toward the suction aperture rather than perpendi