PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The pres...
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Format | Patent |
Language | Chinese English |
Published |
28.01.2022
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Abstract | The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts |
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AbstractList | The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts |
Author | KUROSAWA INATARO SUZUKI TETSUAKI |
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DocumentTitleAlternate | 感光性聚酰亚胺树脂组合物 |
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Notes | Application Number: CN202080041583 |
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Snippet | The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and... |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
Title | PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION |
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