PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

• Main Authors: SUZUKI TETSUAKI, KUROSAWA INATARO
• Format: Patent
• Language: Chinese; English
• Published: 28.01.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts