PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The pres...

Full description

Saved in:
Bibliographic Details
Main Authors SUZUKI TETSUAKI, KUROSAWA INATARO
Format Patent
LanguageChinese
English
Published 28.01.2022
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity.The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts
Bibliography:Application Number: CN202080041583