Manufacturing method of LED display module and LED display module

• Main Authors: ZHANG JINGANG, SUN TIANPENG
• Format: Patent
• Language: Chinese; English
• Published: 17.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a manufacturing method of an LED display module and the LED display module, and belongs to the technical field of display. The manufacturing method comprises the following steps: inversely fixing a plurality of LED chips in array distribution on a transparent adhesive layer of a transparent optical carrier plate to obtain a chip assembly; fixing the sides, where the transparent optical carrier plates are located, of the chip assemblies to the UV glue layer of a plane carrier plate, wherein the chip assemblies are distributed in an array mode to obtain a chip assembly array; welding and fixing an active substrate on the chip assembly array after all the welding spots of the active substrate are aligned with the welding feet of all the LED chips of the chip assembly array one by one to obtain a display module prototype; and carrying out plane carrier plate stripping treatment on the display module prototype to obtain the LED display module. According to the technical scheme, the technica