MICROELECTRONIC ASSEMBLY AND METHOD FOR PREPARATION OF SAME

• Main Authors: LANDESBERGER CHRISTOF, RAMM PETER, KUTTER CHRISTOPH
• Format: Patent
• Language: Chinese; English
• Published: 03.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Embodiments provide a method for manufacturing a microelectronic arrangement. The method includes a step of providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module includes at least one coupling element...