MICROELECTRONIC ASSEMBLY AND METHOD FOR PREPARATION OF SAME

• Main Authors: LANDESBERGER CHRISTOF, RAMM PETER, KUTTER CHRISTOPH
• Format: Patent
• Language: Chinese; English
• Published: 03.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Embodiments provide a method for manufacturing a microelectronic arrangement. The method includes a step of providing a chip-film module with a semiconductor chip and a film substrate having arranged thereon the semiconductor chip, wherein the chip-film module includes at least one coupling element spaced apart from the semiconductor chip and electrically coupled to at least one terminal of the semiconductor chip. Furthermore, the method includes a step of embedding the chip-film module into a printed circuit board, wherein, in embedding the chip-film module into the printed circuit board, the at least one coupling element of the chip-film module is coupled vertically [e.g. in the vertical direction [e.g. in relation to the printed circuit board]] [e.g. perpendicular to a surface of the printed circuit board] to at least one coupling counter element of the printed circuit board. 实施例提供了一种用于制造微电子装置的方法。该方法包括提供具有半导体芯片和该半导体芯片被布置在其上的膜衬底的芯片膜模块的步骤，其中，芯片膜模块包括与半导体芯片间隔开并且电耦合到半导体芯片的至少一个端子的至少一个耦合元件。此外，该方法包括将芯片膜模块嵌入到印刷电路板中