Modified filler and heat-conducting glue, and preparation methods and application thereof

• Main Authors: LIU RUNWEI, LI XIDU, CHEN JUNFEI, YUAN QIANG, HUANG HENGCHAO, JIANG JINBO, FU ZI'EN
• Format: Patent
• Language: Chinese; English
• Published: 19.10.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The invention provides a modified filler. The modified filler is heat-conducting powder modified by a first silane coupling agent and a second silane coupling agent in sequence, wherein the second silane coupling agent is modified silane containing a cyclohexyl group and a carbamido group; and the m...