Modified filler and heat-conducting glue, and preparation methods and application thereof

• Main Authors: LIU RUNWEI, LI XIDU, CHEN JUNFEI, YUAN QIANG, HUANG HENGCHAO, JIANG JINBO, FU ZI'EN
• Format: Patent
• Language: Chinese; English
• Published: 19.10.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The invention provides a modified filler. The modified filler is heat-conducting powder modified by a first silane coupling agent and a second silane coupling agent in sequence, wherein the second silane coupling agent is modified silane containing a cyclohexyl group and a carbamido group; and the modified silane takes 4-methylcyclohexyl isocyanate and/or cyclohexyl isocyanate as a grafting modification reactant. The modified filler has strong adhesion, has good permeability and compatibility with a plastic substrate, and can be directly mixed with polysiloxane, and the viscosity of a mixed heat-conducting system is low. In addition, the production process required by the modified filler is simple and convenient, and large-scale popularization can be realized. 本发明提供了一种改性填料，所述改性填料为依次采用第一硅烷偶联剂和第二硅烷偶联剂进行改性的导热粉；所述第二硅烷偶联剂为含有环己基与脲基的改性硅烷；所述改性硅烷以4-甲基环己基异氰酸酯和/或环己基异氰酸酯为接枝改性反应物。该改性填料粘接性较强，其与塑料基材之间还具有良好的浸透性与兼容性，且该改性填料可以与聚硅氧烷直接混合，混合后的导热体系粘度较低。此外，该改性填料所需生产工艺简便，可实现大规模推广。