ELECTROSTATIC CHUCK FOR HIGH BIAS RADIO FREQUENCY (RF) POWER APPLICATION IN PLASMA PROCESSING CHAMBER

Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second...

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Bibliographic Details
Main Authors TIAN PENG, JO JAE-RYONG, RAUF SHAHID
Format Patent
LanguageChinese
English
Published 01.10.2021
Subjects
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