ELECTROSTATIC CHUCK FOR HIGH BIAS RADIO FREQUENCY (RF) POWER APPLICATION IN PLASMA PROCESSING CHAMBER

Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second...

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Bibliographic Details
Main Authors TIAN PENG, JO JAE-RYONG, RAUF SHAHID
Format Patent
LanguageChinese
English
Published 01.10.2021
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Summary:Embodiments of an electrostatic chuck are provided herein. In some embodiments, an electrostatic chuck for use in a substrate processing chamber includes a plate having a first side and a second side opposite the first side, a first electrode embedded in the plate proximate the first side, a second electrode embedded in the plate proximate the second side, a plurality of conductive elements coupling the first electrode to the second electrode, a first gas channel disposed within the plate and between the first electrode and the second electrode, a gas inlet extending from the second side of the plate to the first gas channel; and a plurality of gas outlets extending from the first side of the plate to the first gas channel. 此处提供静电卡盘的实施例。在一些实施例中,一种在基板处理腔室中使用的静电卡盘,包括:板,具有第一侧和与第一侧相对的第二侧;第一电极,嵌入板中靠近第一侧;第二电极,嵌入板中靠近第二侧;多个导电元件,将第一电极耦合至第二电极;第一气体通道,设置于板内并且介于第一电极及第二电极之间;气体入口,从板的第二侧延伸至第一气体通道;以及多个气体出口,从板的第一侧延伸至第一气体通道。
Bibliography:Application Number: CN202080017081