ESTER COMPOUND, RESIN COMPOSITION, CURED PRODUCT, AND BUILD-UP FILM

• Main Authors: KAWAHARA YUKO, TAKEDA KOHEI, HAYASHI TATSUSHI, SHINDO MASAMI, KUBO AKIKO
• Format: Patent
• Language: Chinese; English
• Published: 17.08.2021
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The purpose of the present invention is to provide an ester compound that can be used in a resin composition that has excellent heat resistance and dielectric properties after curing. Additionally, the purpose of the present invention is to provide the resin composition containing the ester compound; a cured product of the resin composition; and a build-up film that is produced by using the resin composition. The present invention is the ester compound having a phenylene ether oligomer structure in the main chain thereof, and having a polycyclic aromatic carbonyloxy group at both ends thereof. 本发明的目的在于提供能够用于固化后的耐热性和介电特性优异的树脂组合物的酯化合物。另外，本发明的目的在于提供含有该酯化合物的树脂组合物、该树脂组合物的固化物及使用该树脂组合物而成的积层膜。本发明为主链具有亚苯基醚低聚物结构，并且在两末端具有多环式芳香族环羰氧基的酯化合物。