Low-dielectric-constant polyhedral oligomeric silsesquioxane/epoxy resin nano composite material and preparation method thereof

• Main Authors: CUI XIN, ZHANG TIANYAN, CHE JUNBO, HU JINJIN, WEI HUAIXIAO, HUAI KAI, WU WEIFEI, ZHANG JIANMING, CHEN YUWEI, HU ZHENDONG, WANG QUAN, ZHANG BAILANG
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention relates to the technical field of integrated circuits, in particular to a low-dielectric-constant polyhedral oligomeric silsesquioxane/epoxy resin nano composite material and a preparation method thereof. The low-dielectric-constant polyhedral oligomeric silsesquioxane/epoxy resin nano...