PAD LIMITED CONFIGURABLE LOGIC DEVICE
An integrated circuit provides a semiconductor die with I/O bond pads (1710), a power bond pad, and a circuit ground pad. Each I/O bond pad is associated with an input circuit (1802) that has an input circuit output lead (1814). Sets of digital logic functional circuitry (1804) on the die provide di...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
25.05.2021
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Subjects | |
Online Access | Get full text |
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