PAD LIMITED CONFIGURABLE LOGIC DEVICE

An integrated circuit provides a semiconductor die with I/O bond pads (1710), a power bond pad, and a circuit ground pad. Each I/O bond pad is associated with an input circuit (1802) that has an input circuit output lead (1814). Sets of digital logic functional circuitry (1804) on the die provide di...

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Bibliographic Details
Main Authors COYLE PHILIP ANTHONY, BRITO JOAO CARLOS
Format Patent
LanguageChinese
English
Published 25.05.2021
Subjects
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