PAD LIMITED CONFIGURABLE LOGIC DEVICE

• Main Authors: COYLE PHILIP ANTHONY, BRITO JOAO CARLOS
• Format: Patent
• Language: Chinese; English
• Published: 25.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An integrated circuit provides a semiconductor die with I/O bond pads (1710), a power bond pad, and a circuit ground pad. Each I/O bond pad is associated with an input circuit (1802) that has an input circuit output lead (1814). Sets of digital logic functional circuitry (1804) on the die provide different digital logic functions. Each function includes logic input leads (1844) and logic output leads (1846). Output circuits (1806) each have an output circuit in lead (1820) and an output circuit out lead (1822). Strapping structures, such as vias, formed in the semiconductor die electrically couple input circuits to a selected set of digital logic functions and the selected set of digital logic functions to output circuit in leads. Upper level metal conductors couple output circuit out leads and selected I/O bond pads. 一种集成电路提供了带有I/O键合焊盘(1710)、电源键合焊盘和电路接地焊盘的半导体管芯。每个I/O键合焊盘与具有输入电路输出引线(1814)的输入电路(1802)相关联。管芯上的多组数字逻辑功能电路系统(1804)提供了不同的数字逻辑功能。每个功能包括逻辑输入引线(1844)和逻辑输出引线(1846)。输出电路(1806)分别具有输出电路引入引线(1820)和输出电路引出引线(182