Package structure and forming method thereof
Some embodiments of the present disclosure provide a package structure and a method of forming the same. The package structure includes a package substrate, an interposer substrate over the package substrate, and a plurality of semiconductor devices over the interposer substrate. The interposer subs...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
09.03.2021
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Subjects | |
Online Access | Get full text |
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