Package structure and forming method thereof

• Main Authors: XU FENGCHENG, CHEN SHUOMAO, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 09.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Some embodiments of the present disclosure provide a package structure and a method of forming the same. The package structure includes a package substrate, an interposer substrate over the package substrate, and a plurality of semiconductor devices over the interposer substrate. The interposer subs...