Package structure and forming method thereof

• Main Authors: XU FENGCHENG, CHEN SHUOMAO, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 09.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Some embodiments of the present disclosure provide a package structure and a method of forming the same. The package structure includes a package substrate, an interposer substrate over the package substrate, and a plurality of semiconductor devices over the interposer substrate. The interposer substrate also has one or more recesses to receive or accommodate additional semiconductor devices thatare not allowed to be mounted on a surface of the interposer substrate. The groove enables the whole package structure to be thinner. Some semiconductor devices housed in the grooves of the interposersubstrate may also be electrically connected to the interposer substrate and/or the semiconductor devices over the interposer substrate to improve electrical performance of the overall package structure. 本公开一些实施例提供一种封装结构及其形成方法。封装结构包括封装基板、位于封装基板上方的中介层基板以及位于中介层基板上方的多个半导体装置。中介层基板还具有一或多个凹槽，以收容或容纳不被允许安装在中介层基板表面上的附加的半导体装置。凹槽使得整体封装结构更薄。一些收容在中介层基板的凹槽中的半导体装置也可以电连接到中介层基板及/或中介层基板上方的半导体装置，以改善整体封装结构的电性能。