Semiconductor device package assembly and manufacturing method thereof

• Main Authors: IM SEUNG-WON, KIM JEUNG-DAE, JEON O-SEOB
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a semiconductor device package assembly and a method of manufacturing the same. In one general aspect, a semiconductor device package can include a die attach paddle having afirst surface and a second surface that is opposite the first surface. The package can also include a...