Semiconductor device package assembly and manufacturing method thereof

• Main Authors: IM SEUNG-WON, KIM JEUNG-DAE, JEON O-SEOB
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a semiconductor device package assembly and a method of manufacturing the same. In one general aspect, a semiconductor device package can include a die attach paddle having afirst surface and a second surface that is opposite the first surface. The package can also include a semiconductor die coupled with the first surface of the die attach paddle. The package can furtherinclude a direct-bonded-metal (DBM) substrate. The DBM substrate can include a ceramic layer having a first surface and a second surface that is opposite the first surface; a first metal layer disposed on the first surface of the ceramic layer and coupled with the second surface of the die attach paddle; and a second metal layer disposed on the second surface of the ceramic layer. The second metal layer can be exposed external to the semiconductor device package. The second metal layer can be electrically isolated from the first metal layer by the ceramic layer. 本发明题为"半导体器件封装组件及其制造方法"。在一个整体方面，半导体器件封装件可包括管芯附接桨叶，该管芯附接桨叶