Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressurized brazing sealing method thereof
The invention relates to a lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. A metal layer is prefabricated in a to-be-sealed area of the tempered vacuum glass, in the lead-free solder, In accounts for 5.0%-15.0% of the...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
22.01.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. A metal layer is prefabricated in a to-be-sealed area of the tempered vacuum glass, in the lead-free solder, In accounts for 5.0%-15.0% of the weight of the solder, Ag accounts for 0.5%-5.0% of the weight of the solder, Ga accounts for 0.05%-2.0% of the weight of the solder, the balance is Sn, and the content of inevitable impurities is smaller than 0.2%. The solder contains few components, is low in melting temperature and good in wettability, and meets the low-temperature sealing requirement of tempered vacuum glass, meanwhile, a pressurized brazing technology is adopted for sealing in the atmospheric environment, the solder can form a good sealing joint with a tempered glass substrate prefabricated with the metal layer, and the production and use requirements are met. The solder overcomes the defects of high sealing temperature, complex technological |
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Bibliography: | Application Number: CN202011025072 |