Lead-free solder for sealing tempered vacuum glass in atmospheric environment and pressurized brazing sealing method thereof

The invention relates to a lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. A metal layer is prefabricated in a to-be-sealed area of the tempered vacuum glass, in the lead-free solder, In accounts for 5.0%-15.0% of the...

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Bibliographic Details
Main Authors ZHANG HONGXIA, LI ZI'ANG, CAO FULEI, LI YANBING, REN PENGKAI, CHU YADONG, YANG YIBO, XU DONGXIA
Format Patent
LanguageChinese
English
Published 22.01.2021
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Summary:The invention relates to a lead-free solder for sealing tempered vacuum glass in an atmospheric environment and a pressurized brazing sealing method thereof. A metal layer is prefabricated in a to-be-sealed area of the tempered vacuum glass, in the lead-free solder, In accounts for 5.0%-15.0% of the weight of the solder, Ag accounts for 0.5%-5.0% of the weight of the solder, Ga accounts for 0.05%-2.0% of the weight of the solder, the balance is Sn, and the content of inevitable impurities is smaller than 0.2%. The solder contains few components, is low in melting temperature and good in wettability, and meets the low-temperature sealing requirement of tempered vacuum glass, meanwhile, a pressurized brazing technology is adopted for sealing in the atmospheric environment, the solder can form a good sealing joint with a tempered glass substrate prefabricated with the metal layer, and the production and use requirements are met. The solder overcomes the defects of high sealing temperature, complex technological
Bibliography:Application Number: CN202011025072