Substrate dielectric crack prevention using interleaved metal plane

• Main Authors: CEJKA STANLEY ANDREW, ZHOU TINGDONG, FOONG CHEE SENG, EICHMAN TWILA JO, GOLAB JAMES S
• Format: Patent
• Language: Chinese; English
• Published: 29.12.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of a substrate are provided herein, which include: a first metal plane and a second metal plane in a first metal layer, the first and second metal planes laterally separated by a first gapof dielectric material; and a third metal plane and a fourth metal plane in a second metal layer vertically adjacent to the first metal layer, the third and fourth metal planes laterally separated bya second gap of dielectric material, wherein the second gap comprises a first laterally-shifted gap part and a second laterally-shifted gap part, the first laterally-shifted gap part is laterally offset from a vertical footprint of the first gap in a first lateral direction, and the second laterally-shifted gap part is laterally offset from the vertical footprint of the first gap in a second lateral direction opposite the first lateral direction. 本文中提供一种基板的实施例，所述基板包括：第一金属层中的第一金属平面和第二金属平面，所述第一金属平面和所述第二金属平面通过介电材料的第一间隙横向分离；以及在与所述第一金属层纵向相邻的第二金属层中的第三金属平面和第四金属平面，所述第三金属平面和所述第四金属平面通过介电材料的第二间隙横向分离，其中所述第二间隙包括第一横向移位的间隙部分和第二横向移位的