THERMAL PEELING TYPE ADHESIVE SHEET

• Main Authors: ARIMITSU YUKIO, FUKUHARA ATSUHITO, HIRAYAMA TAKAMASA, SOEJIMA KAZUKI
• Format: Patent
• Language: Chinese; English
• Published: 23.10.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

Provided is a thermal peeling type adhesive sheet that can be favorably used when processing a material of an electronic component, the adhesive sheet exhibiting sufficient fixation properties not only to an adherend with a flat adhering surface but also an adherend with an uneven surface. The thermal peeling type adhesive sheet is a thermally peeling adhesive sheet provided with an adhesive layer. The thermal peeling type adhesive sheet comprises an antistatic material. The adhesive layer contains an adhesive and thermally expandable microspheres. A base polymer constituting the adhesive contains a constituent unit A derived from an alkyl (meth) acrylate, the content ratio of the constituent unit A in the base polymer is 20 wt% or more, and the constituent unit A derived from the alkyl (meth) acrylate contains a side chain having a branched chain structure. 本发明提供一种热剥离型粘合片，其为可以适宜地在电子部件材料的加工时使用的粘合片，其不仅对被粘面为平面的被粘物表现出充分的固定性，对具有凹凸面的被粘物也表现出充分的固定性。本发明的热剥离型粘合片为具备粘合剂层的热剥离型粘合片，其中，该热剥离型粘合片包含抗静电材料，该粘合剂层包含粘合剂及热膨胀性微球，构成该粘