Semiconductor manufacturing device and method

• Main Authors: YUKI NAKUI, OKAMOTO NAOKI, KURIHARA YOSHIHIRO, SAITO AKIRA, IKARASHI ITSUKI
• Format: Patent
• Language: Chinese; English
• Published: 08.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a semiconductor manufacturing device and method capable of controlling a pushing unit with an optimal timing from the perspective of low pressure performance or high-speed pick-up performance of a bare chip. The semiconductor manufacturing device includes: a pushing unit that pushes a bare chip from below a dicing tape and has a plurality of blocks in contact with the dicing tape; a collet chuck, which adsorbs the bare chip; and a control unit, which is configured that for a peeling mode that reappears the characteristics of the pushing unit, feedback control isperformed so that the output of the peeling model follows the target value of bending stress of the entire bare chip and peeling amount of the bare chip from the dicing tape, and the pushing amount, which is control input to the peeling model, becomes the pushing amount of the blocks by pushing means. 本发明提供一种从对裸芯片的低压力性或高速拾取性的观点考虑能够以最佳的时序控制顶推单元的半导体制造装置及半导体器件的制造方法。半导体制造装置具备：顶推单元，其从上述切割带的下方顶推裸芯片，具有与切割带接触的多个块；筒夹，其吸附上述裸芯片；和控制部