MICROPHONE PACKAGE

• Main Authors: WATSON JOSHUA, LIM TONY K, SZCZECH JOHN
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2020
• Subjects: DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; PUBLIC ADDRESS SYSTEMS

A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening intothe embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate. 一种麦克风，麦克风包括基板，基板在基板的第一表面与基板的相反的第二表面之间限定嵌入腔，第一表面限定通向嵌入腔的第一开口，第一表面与第二表面之间的距离限定基板厚度。盖设置在基板的第一表面上并形成壳体，盖包括端口，基板厚度大于盖距基板的第一表面的