Manufacturing device and manufacturing method of laminated ceramic electronic component
The invention provides a manufacturing device of a laminated ceramic electronic component and a manufacturing method of the laminated ceramic electronic component, and stacking offset does not occurs.The manufacturing device of a laminated ceramic electronic component (10) provided with a laminated...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
10.04.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention provides a manufacturing device of a laminated ceramic electronic component and a manufacturing method of the laminated ceramic electronic component, and stacking offset does not occurs.The manufacturing device of a laminated ceramic electronic component (10) provided with a laminated body (12) configured by laminating a plurality of ceramic green sheets, the device being provided with: a first stage (50) for holding the ceramic green sheets (54) formed on a carrier film (52); a cutter (74) for cutting the ceramic green sheet (54) on the first table (50); a suction unit (70) forsucking the cut ceramic green sheet (56a) and peeling the ceramic green sheet; and a laminating unit that moves the ceramic green sheets (56a) peeled off by the suction unit (70) from the first table(50) to the second table (90), laminates the ceramic green sheets (56a) on the second table (90), and further includes a coating unit (80) that coats the ceramic green sheets (56a) with water.
本发明提供一种不发生堆叠偏移的层叠陶瓷电子部件的制造装置以及层叠陶 |
---|---|
Bibliography: | Application Number: CN201910931875 |