Current sensor package

• Main Authors: WEN YENTING, HALL JEFFERSON W, SEDDON MICHAEL J
• Format: Patent
• Language: Chinese; English
• Published: 28.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The subject of the invention is a current sensor package. Provided is a semiconductor package, which includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through.At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole. 本发明题为"电流传感器封装件"。本发明提供一种半导体封装件，该半导体封装件包括半导体管芯。该半导体封装件和半导体管芯中的通孔从该半导体封装件和管芯的一侧延伸到该半导体封装件和管芯的相对侧。该通孔被配置为接纳穿过其中的载流导体。至少一个电流传感器形成在该半导体管芯之中或之上并被配置为感测接纳在该通孔中的该载流导体中的电流流动。