Rotary adjusting type electroplating device

• Main Authors: PENG HONGJUN, DING HUIMEI, YUAN XIAOJU, HE AIZHI, DING RONGJUN, LEI TING
• Format: Patent
• Language: Chinese; English
• Published: 29.11.2019
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses a rotary adjusting type electroplating device which comprises a support, a moving plate, a drive mechanism, a floating mechanism, a plated piece hanging frame, a first rotatingmechanism and a second rotating mechanism. According to the rotary adjusting type electroplating device, the second rotating mechanism is additionally arranged, thus an abutting-against floating oblique plate rotates and can be adjusted, the first rotating mechanism drives a supporting oblique plate to rotate by the corresponding angle, thus the purpose of adjusting the inclination angles of theabutting-against floating oblique plate and the supporting oblique plate is achieved, when the inclination included angle A and the inclination included angle B are large, under the circumstance of the same speed, the distance of moving longitudinally along the supporting oblique plate of the abutting-against floating oblique plate is larger, and when the inclination included angle A and the inclination included angle B ar