Femtosecond laser machining-based auxiliary device

• Main Author: DAI LINTAO
• Format: Patent
• Language: Chinese; English
• Published: 25.10.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention aims to provide a femtosecond laser machining-based auxiliary device. A femtosecond laser machining machine is above a worktable; the right part of the worktable extends to the lower right of the laser machining machine leftwards; a sliding rail which slides left and right is arranged at the top of the worktable; a sliding base is arranged on the sliding rail; a placement table is arranged at the top of the sliding base; a material box is arranged on the right front side of the worktable; a blanking conveyer belt is arranged on the right rear side of the worktable; pushing down air cylinders are arranged at the tops of the front side and the rear side of the right part of the femtosecond laser machining machine; and the bottoms of the pushing down air cylinders are connectedwith a block cover. The placement table is arranged for holding a machined workpiece; the placement is arranged on the sliding base and can slide to the position below the femtosecond laser machiningmachine for machining; aft