Process manufacturing method of circuit module

The invention discloses a process manufacturing method for a circuit module, and the method comprises the steps: obtaining a circuit position and a connection relation of the circuit module on a circuit design layout, and extracting a corresponding logic relation of the circuit module during data in...

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Bibliographic Details
Main Author YUE YONGQIANG
Format Patent
LanguageChinese
English
Published 18.10.2019
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:The invention discloses a process manufacturing method for a circuit module, and the method comprises the steps: obtaining a circuit position and a connection relation of the circuit module on a circuit design layout, and extracting a corresponding logic relation of the circuit module during data interaction; configuring a signal conversion unit for photoelectric conversion and/or electro-opticalconversion for each circuit module according to the circuit positions of the circuit modules on the circuit design layout and the logic relationship; designing and manufacturing an electronic device comprising the circuit module and the signal conversion unit corresponding to the circuit module according to the configured signal conversion unit and the circuit position and the connection relationship of the circuit module on the circuit design layout. The technology provided by the invention is grafted on a chip, a device or an electronic product, and optical transmission data is used for replacing a traditional metal
Bibliography:Application Number: CN201910617318