Insulation covered conductive particles, anisotropic conductive film, method for producing anisotropic conductive film, connection structure and method for producing connection structure

• Main Authors: MORIYA TOSHIMITSU, ICHIMURA TAKAYUKI, IZAWA HIROYUKI, TANAKA MASARU, AKAI KUNIHIKO
• Format: Patent
• Language: Chinese; English
• Published: 06.09.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

According to the present invention, each one of insulation covered conductive particles comprises a conductive base material particle and insulating fine particles that cover the surface of the base material particle, and has a sparse region where the number of the insulating fine particles per unit area is small or 0 and a dense region where the number of the insulating fine particles per unit area is larger than that of the sparse region. 一种绝缘被覆导电粒子，其具备具有导电性的基材粒子、和被覆该基材粒子的表面的绝缘性微粒，并且具有每单位面积的绝缘性微粒数少或为0的疏区域、和每单位面积的绝缘性微粒数比疏区域多的密区域。