Non-contact crack opening displacement measuring device and method for bending fracture test

• Main Authors: YOU ZESHENG, QU SHOUDAO
• Format: Patent
• Language: Chinese; English
• Published: 27.08.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention belongs to the field of material performance test, and especially relates to a non-contact crack opening displacement measuring device and method for a bending fracture test. The non-contact crack opening displacement measuring device comprises a mechanical experimental machine; a bend...