Device and method for silicon ring chamfering

• Main Authors: BAI DUJUAN, MENG XUEYING, YUAN WEILONG, KU LIMING, ZHU QINFA, LI YAGUANG
• Format: Patent
• Language: Chinese; English
• Published: 25.06.2019
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

The invention discloses a device and method for silicon ring chamfering. The device comprises a tool handle, a tool and a chip discharging opening, wherein the chip discharging opening is located at the bottom of the tool, the tool is provided with an inner diameter grinding surface and a chamfering grinding surface, and an included angle is formed between the chamfering grinding surface and the inner diameter grinding surface. The method for silicon ring chamfering with the device includes the following steps that (1) a silicon ring is fixed on a clamping fixture, and cutting liquid is continuously sprayed to the silicon ring; (2) chamfering machining is carried out in a face-to-face mode by means of the device, the rotating speed and the feeding amount of the tool are adjusted, and required shapes and sizes of silicon ring chamfers are achieved; and (3) after chamfering is completed, oil stains and surface slag are removed through ultrasonic cleaning and boiling. The device and method are used for machining