Modular multifunctional IC wafer mounting equipment

• Main Author: ZHU YURU
• Format: Patent
• Language: Chinese; English
• Published: 18.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses modular multifunctional IC wafer mounting equipment. The modular multifunctional IC wafer mounting equipment comprises a bottom frame, two portal frames, and an X-axis cross beam, wherein an X-axis linear motor is arranged on the X-axis cross beam; a rotor of the X-axis linear motor is connected with a first connecting plate, and a suction module and a dispensing head are arranged on the first connecting plate; a group of Y-axis linear motors are arranged on each portal frame separately, wherein the rotor of each Y-axis linear motor is connected with a second connectingplate separately; the two ends of the X cross beam are connected with the corresponding second connecting plate separately; a crystal disc feeding module is detachably arranged on one side of the bottom frame; and a crystal disc taking and placing fixing module is detachably arranged on the bottom frame. According to the modular multifunctional IC wafer mounting equipment provided by the invention, the modularization deg