IMPROVED EXPANDABLE VINYL AROMATIC POLYMERS

• Main Authors: DELEYE JEAN-CLAUDE, URBANCZYK LAETITIA, IACOLINA AMELIO, MICHEL JACQUES, CASSART MICHEL, VACHAUDEZ MAGALI
• Format: Patent
• Language: Chinese; English
• Published: 07.06.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

The present invention is related to expandable vinyl aromatic polymers comprising comminuted coke, said comminuted coke having an average stack height (Lc) of carbon crystallites at least 4 nm, a volume median particle diameter (D50) comprised between 1 and less than 5 mumm and being characterized by a span (D90-D10)/D50 below 2.5 Molded parts produced from the expandable vinyl aromatic polymers prove low thermal conductivities for a low foam density. 本发明涉及包括粉碎的焦炭的能膨胀的乙烯基芳族聚合物,所述粉碎的焦炭具有至少4nm的碳微晶平均堆积高度(Lc)、1-小于5μm的体积中值粒径(D50)并且特征在于低于2.5的跨度(D90-D10)/D50。由所述能膨胀的乙烯基芳族聚合物制造的模塑部件证明对于低的泡沫密度而言低的热导率。