Efficient electronic tag packaging process and device
The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
24.05.2019
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Subjects | |
Online Access | Get full text |
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Abstract | The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be glued to a gluing working station; gluing the points on the antenna coils in the unit working areacorresponding to chip pins by a gluing module; conveying the unit working area to an adhesion station; transferring chips to a transfer seat by a chip transfer module, wherein the number and the position layout of the chips on the transfer seat exactly correspond to the number and the position layout of the antenna coils in the unit work area; driving the transfer seat to get close to the unit work area by an adhesion driving module, so that the chips are simultaneously and correspondingly attached to the antenna coils; hot-pressing the chips by a hot-pressing module; and collecting the chips.The device comprises a tr |
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AbstractList | The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be glued to a gluing working station; gluing the points on the antenna coils in the unit working areacorresponding to chip pins by a gluing module; conveying the unit working area to an adhesion station; transferring chips to a transfer seat by a chip transfer module, wherein the number and the position layout of the chips on the transfer seat exactly correspond to the number and the position layout of the antenna coils in the unit work area; driving the transfer seat to get close to the unit work area by an adhesion driving module, so that the chips are simultaneously and correspondingly attached to the antenna coils; hot-pressing the chips by a hot-pressing module; and collecting the chips.The device comprises a tr |
Author | GU JINRU WU WEIWEN LAI HANJIN WANG KAILAI PENG HUAMING |
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DocumentTitleAlternate | 一种高效的电子标签封装工艺及设备 |
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Snippet | The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on... |
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SubjectTerms | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES |
Title | Efficient electronic tag packaging process and device |
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