Efficient electronic tag packaging process and device

The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be...

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Main Authors WANG KAILAI, WU WEIWEN, LAI HANJIN, GU JINRU, PENG HUAMING
Format Patent
LanguageChinese
English
Published 24.05.2019
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Abstract The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be glued to a gluing working station; gluing the points on the antenna coils in the unit working areacorresponding to chip pins by a gluing module; conveying the unit working area to an adhesion station; transferring chips to a transfer seat by a chip transfer module, wherein the number and the position layout of the chips on the transfer seat exactly correspond to the number and the position layout of the antenna coils in the unit work area; driving the transfer seat to get close to the unit work area by an adhesion driving module, so that the chips are simultaneously and correspondingly attached to the antenna coils; hot-pressing the chips by a hot-pressing module; and collecting the chips.The device comprises a tr
AbstractList The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on a substrate as a unit working area, and disposing a plurality of antenna coils in each unit working area; conveying a unit working area to be glued to a gluing working station; gluing the points on the antenna coils in the unit working areacorresponding to chip pins by a gluing module; conveying the unit working area to an adhesion station; transferring chips to a transfer seat by a chip transfer module, wherein the number and the position layout of the chips on the transfer seat exactly correspond to the number and the position layout of the antenna coils in the unit work area; driving the transfer seat to get close to the unit work area by an adhesion driving module, so that the chips are simultaneously and correspondingly attached to the antenna coils; hot-pressing the chips by a hot-pressing module; and collecting the chips.The device comprises a tr
Author GU JINRU
WU WEIWEN
LAI HANJIN
WANG KAILAI
PENG HUAMING
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Snippet The invention discloses an efficient electronic tag packaging process and device. The process comprises the steps of setting a region having a certain size on...
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SubjectTerms ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
Title Efficient electronic tag packaging process and device
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