Silicon wafer slicing machine production time simulation method and device

• Main Authors: LUO XIANGYU, WANG HUIZHI, WANG XUERONG, ZHAO NAN, QI CHENGTIAN, JIN XUE, RAN RUIYING
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2019
• Subjects: PERFORMING OPERATIONS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention provides a silicon wafer slicing machine production time simulation method. The method comprises the steps that a slicing machine simulation model is established; the slicing machine simulation model comprises step information of a slicing machine, wherein the step information comprises the feeding step, the cutting step, the discharging step, the cleaning step, the waiting step, thebroken wire replacing step, the guide wheel replacing step, the main roll replacing step and the pay-off reel replacing step; the slicing machine simulation model obtains to-be-implemented step information according to preset rules; time data corresponding to the to-be-implemented step information is distributed for the to-be-implemented step information according to historical data, wherein thehistorical data include historical time data corresponding to the step information of the slicing machine; the steps in the to-be-implemented step information are implemented in sequence to obtain thesum of the time data of al