EPOXY RESIN COMPOSITION FOR SEALING SOLID STATE SEMICONDUCTOR DEVICE, ENCAPSULATING MATERIAL COMPRISING SAME, AND SEMICONDUCTOR PACKAGE

• Main Authors: LEE EUN JUNG, BAE KYOUNG CHUL, LEE YOON MAN, PARK YONG YEUP
• Format: Patent
• Language: Chinese; English
• Published: 12.02.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to: a resin composition for sealing a solid state semiconductor device, comprising an epoxy resin containing a compound represented by chemical formula 1, a curing agent,and an inorganic filler; an encapsulating material comprising the same; and a semiconductor package. The resin composition for sealing a semiconductor device has a low coefficient of thermal expansion and a high glass transition temperature, thereby enabling warpage to be minimized. 本发明涉及种用于密封固态半导体器件的树脂组合物，其包括含有由化学式1表示的化合物的环氧树脂、固化剂和无机填料；包含其的封装材料；和半导体封装件。用于密封半导体器件的树脂组合物具有低热膨胀系数和高玻璃化转变温度，从而能够使翘曲最小化。