MODULE

Provided is a module having high reliability by, when a sealing resin layer is formed using a mold, suppressing the generation of air bubbles due to flow resistance in the resin increasing. A module 1a is provided with a wiring board 2, components 3a, 3b mounted on an upper surface 2a of the wiring...

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Bibliographic Details
Main Author YAMAMOTO ISSEI
Format Patent
LanguageChinese
English
Published 25.01.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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