MODULE

• Main Author: YAMAMOTO ISSEI
• Format: Patent
• Language: Chinese; English
• Published: 25.01.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a module having high reliability by, when a sealing resin layer is formed using a mold, suppressing the generation of air bubbles due to flow resistance in the resin increasing. A module 1a is provided with a wiring board 2, components 3a, 3b mounted on an upper surface 2a of the wiring board 2 and a sealing resin layer 4 laminated on the upper surface 2a. In an upper surface 4a, the sealing resin layer 4 comprises a high region 41 a far distance from the upper surface 2a of the wiring board 2, a low region 42 a close distance from the upper surface 2a and a stepped region 43. Further, portions of the wiring board 2 corresponding to the low region 42 and the stepped region 43 are formed thinner than the other portions and a thin part 21a is formed such that, in planar view, atleast a part thereof overlaps with the low region 42. 本发明提供模块，在使用金属模具形成密封树脂层时，抑制因树脂的流动阻力上升而产生气泡，由此可靠性较高。模块(1a)具备：布线基板(2)、安装在布线基板(2)的上表面(2a)的各部件(3a、3b)、和层叠于上表面(2a)的密封树脂层(4)。密封树脂层(4)在上表面(4a)上，具有距布线基板(2)的上表面(2a)的距离通过的高处区域(41)、距上