A method for controlling the warp of a product of a multilayer PCB board module

• Main Authors: ZHU HUAIDE, GAO YANRU, FANG LEI, LIN YONGGANG, XU CHAOXIONG, JIAN XIGAO
• Format: Patent
• Language: Chinese; English
• Published: 18.12.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a method for controlling the warp of a product of a multilayer PCB board module, (1) setting the preset dimension of each layer of PCB board MI to be at least 1 mm larger thanthe salvage dimension after lamination, adding auxiliary copper in the copper-free area in the inner layer pattern of the corresponding inner layer PCB board, and then carrying out inner layer etchingaccording to the inner layer pattern of the preset PCB board to obtain several inner layer PCB boards; (2), laminate and fixing that out layer PCB board and several inner layer PCB boards made in thestep 1 into one body accord to a preset structure; 3) processing that outer lay PCB board according to the preset structure; (4) After screen printing and tin spraying, the PCB is tested, and the multi-layer PCB module with board warp control is made. The scheme optimizes the PCB structure design and selection of each layer of the multi-layer PCB to control board warp, which is not only convenient and reliable, but also ca