ELECTRONIC CIRCUIT BOARD AND ULTRASONIC BONDING METHOD

• Main Authors: KUNIGAMI MASAKI, MASUDA TSUGIO, FUEKI NOBUHIRO
• Format: Patent
• Language: Chinese; English
• Published: 26.10.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Provided are: an electronic circuit board which is provided with a substrate containing a synthetic resin and one conductor bonded to the upper surface of the substrate, said electronic circuit boardbeing capable of improving the bonding quality of another conductor to the one conductor; and an ultrasonic bonding method. A PCB (1) comprises a reinforcing member (12) that is constituted of a material having a higher melting point than the synthetic resin that constitutes a substrate (10). A first reinforcing member (121), which constitutes the reinforcing member (12), is constituted of a substantially planer or belt-like metal embedded in the substrate (10) so as to at least partly overlap upper surface wiring (11). A second reinforcing member (122), which constitutes the reinforcing member (12), is constituted of a substantially columnar metal that extends vertically, is connected to the bottom surface of the upper surface wiring (11), and is physically, chemically, or mechanically linked to the first reinfor