Circuit board structure and manufacturing method thereof

• Main Authors: CHEN WEIKUN, FU WEI-TA, HUANG HAOWEI
• Format: Patent
• Language: Chinese; English
• Published: 23.10.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The embodiment of the disclosure relates to a circuit board structure and a manufacturing method thereof. The method includes steps: providing a metal-coated laminated plate, the metal-coated laminated plate comprises a base plate and a first metal layer arranged on the base plate; forming a through hole penetrating through the metal-coated laminated plate, forming a second metal layer on the first metal layer and extending into the through hole to form an electroplated through hole, filling in the electroplated through hole with a hole-plugigng material, removing a part of the first metal layer and the second metal layer to expose two opposite surfaces of the base plate, forming a third metal layer on the base plate and two opposite surfaces of the hole-plugging material, forming a patterned mask layer comprising a line layer groove and exposing the third metal layer on the hole-plugging material on the third metal layer, and forming a line layer in the line layer groove and forming ametal pad on the thirid