Packaging adhesive for semiconductor sealing and preparation method therefor

• Main Authors: XU JINGWEN, KANG RUNHUA, YANG HUIYU, ZHANG CHUANYONG
• Format: Patent
• Language: Chinese; English
• Published: 12.10.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention provides a packaging adhesive for semiconductor sealing and a preparation method therefor. The packaging adhesive for semiconductor sealing is prepared from the following raw materials in parts by mass: 80-150 parts of epoxy resin composition, 70-170 parts of curing agent, 1-5 parts of antifoamer, 1-5 parts of silane coupler and 1,800-2,900 parts of inorganic filler, wherein the epoxy resin composition is prepared from bisphenol A liquid epoxy resin, alicyclic-series epoxy resin and multi-aromatic-ring structured epoxy resin which are in the mass ratio of 1: (0.5 to 8): (0.5 to 8); the inorganic filler is prepared from spherical silicon dioxide and carbon black; and the spherical silicon dioxide has the maximum particle size of 25 microns and the mean particle size of 7 to 15microns. The packaging adhesive for semiconductor sealing, provided by the invention, has fluidity at normal temperature, the viscosity is lower than 4*10 cPs(25 DEG C), the Tg is 140 DEG C to 180DEG C, the CTE alpha 1 is 8p