Circuit board, terminal device and manufacturing method of circuit board

• Main Authors: SUN XUEBIAO, WU HUILAN, LI MING, JI SHENGPING, WU SHUANG
• Format: Patent
• Language: Chinese; English
• Published: 31.07.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a circuit board, a terminal device and a manufacturing method of the circuit board. The circuit board comprises: a substrate on the surface of a plurality of bonding pads are disposed at intervals; and a plurality of metal heat dissipating blocks corresponding to the plurality of bonding pads. Gaps between every two adjacent metal heat dissipating blocks are filled with an insulating layer. Each of the metal heat dissipating blocks comprises a first surface and a second surface which are disposed oppositely. The first surface of each of the metal heat dissipating blocksis connected to the bonding pad corresponding to each of the metal heat dissipating blocks. The second surface of each of the metal heat dissipating blocks is soldered to a component. It can be seen that, in the case that the circuit board supporting the component is not slotted, the heat dissipation of the component can be improved by the circuit board, thereby effectively ensuring the normal operation of the component a