POLISHING HEAD

The invention provides a polishing head, wherein a bearing carrier can be well followed according to the surface state of a grinding pad. Meanwhile, workpieces can be polished in a high-precision manner. The polishing head comprises: a head main body part (12); a carrier (14) being connected to the...

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Bibliographic Details
Main Authors KAZUTAKA SHIBUYA, TAKAYUKI FUSE, MASAYUKI TSUKADA
Format Patent
LanguageChinese
English
Published 20.07.2018
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Summary:The invention provides a polishing head, wherein a bearing carrier can be well followed according to the surface state of a grinding pad. Meanwhile, workpieces can be polished in a high-precision manner. The polishing head comprises: a head main body part (12); a carrier (14) being connected to the head main body part; a pressure chamber (18); a fluid supplying section (47); a linear motion guide(40) having an outer cylindrical body (41) and a spline shaft (42), which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate (45) being provided betweena lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier. 本发明提供研
Bibliography:Application Number: CN201711446236