Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium

• Main Authors: FLAJSLIK, KRISTEN, QIN, YI, LEFEBVRE, MARK
• Format: Patent
• Language: Chinese; English
• Published: 26.01.2018
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

Indium electroplating compositions containing 2-imidazolidinethione compounds electroplate substantially defect-free uniform layers which have a smooth surface morphology on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials. 含有2-咪唑烷硫酮化合物的铟电镀组合物在金属层上电镀具有平滑表面形态的基本上无缺陷的均层。所述铟电镀组合物可用于将铟金属电镀于如半导体晶片的各种衬底的金属层上并且可用作热界面材料。