Package substrate, flip chip package and manufacturing method thereof

• Main Authors: SHAO YUXIU, XIAO YOUXIANG, LIN GUANGLONG, YANG BINGFENG
• Format: Patent
• Language: Chinese; English
• Published: 22.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a package substrate, a flip chip package and a manufacturing method thereof. The package substrate comprises a substrate body, a number of metal wires and a number of thin films. The substrate body comprises a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface are opposite. The metal wires are arranged on the first substrate surface of the substrate body. Each metal wire comprises an upper wire surface and a number of side wire surfaces. The thin films are formed on the side wire surfaces of the metal wires. 种封装基板、覆晶式封装及其制造方法。封装基板，包括基板本体、多数个金属导线与多数个薄膜。基板本体具有相对的第基板表面与第二基板表面。金属导线配置在基板本体的第基板表面上。金属导线具有上导线表面与数个侧导线表面。薄膜形成在金属导线的侧导线表面上。