Suspension polymerization compositions, methods and use thereof

• Main Author: ELIMELECH HILA
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks. 本公开内容涉及热固性增强的树脂组合物和使用多孔颗粒形成板、片和/或膜的方法，所述多孔颗粒浸渍有嵌入的活性单体和/或低聚物和/或聚合物，所述多孔颗粒被配置为部分浸出活性单体和/或低聚物和/或聚合物的功能性末端部，并且与交联剂和光引发的聚合物自由基反应，以形成混合互穿网络的增强的板、片和/或膜。