Photoelectric hybrid integration-based optoelectronic module packaging structure

• Main Authors: CAO LIQIANG, LIU FENGMAN
• Format: Patent
• Language: Chinese; English
• Published: 25.07.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

The present invention provides a photoelectric hybrid integration-based optoelectronic module packaging structure, which comprises a substrate; a planar photonic circuit carrier plate bonded onto the substrate; an optical fiber connector connected to the planar photonic circuit carrier plate; a first optical waveguide located within the planar photonic circuit carrier plate and parallel to the surface of the substrate; a vertical interconnect structure and a bonding pad thereof both located within the substrate; a lens, a photonic device and an electronic device both integrated on the substrate; and a heat dissipation device located above the photonic device. The photonic device is coupled with the first optical waveguide. According to the technical scheme of the invention, the structure is applicable to an on-board optical module and an optical transceiver assembly. Based on the structure, the interconnection loss can be reduced and the high-bandwidth optical interconnection signal propagation is enabled. Th