Modified LED packaging silica gel with high refractive index

• Main Author: ZHUANG HENGDONG
• Format: Patent
• Language: Chinese; English
• Published: 14.07.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The invention relates to modified LED packaging silica gel with a high refractive index. The crosslinking agent of the silica gel is methyl phenyl acrylate modified hydrogen-containing silicon resin, is added with adhesive, has high strength and excellent base material adhesion. The LED packaging silica gel with high refractive index comprises components A and B in a weight ratio of 1:1, wherein the component A is prepared from the following raw materials in parts by weight: 50-60 parts of methyl phenyl vinyl silicone resin, 35-45 parts of methyl phenyl vinyl silicone oil, 0.1-0.3 part of a platinum-base catalyst and 1-5 parts of adhesive; the component B is prepared from the following raw materials in parts by weight: 50-70 parts of crosslinking agent methyl phenyl acrylate modified hydrogen-containing silicon resin, 30-50 parts of methyl phenyl vinyl silicone resin and 0.1-0.3 part of an inhibiting agent. 本发明涉及种改性高折射率的LED封装硅胶，其交联剂为甲基苯基丙烯酸酯改性的含氢硅树脂，并添加粘接剂，强度高，对基材粘接性优异。所述的高折射率LED封装硅胶包括组分A和组分B，所述组分A与组分B的重量比为1∶