Method for analyzing fatigue life of electronic packaging welding spot

• Main Authors: YIN YICHAO, GUO LAIXIAO, MI JINHUA, LI YANFENG, HUANG HONGZHONG, GUO JUNYU, HUANG CHENGGENG
• Format: Patent
• Language: Chinese; English
• Published: 07.07.2017
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention discloses a method for analyzing fatigue life of an electronic packaging welding spot. According to the method, with the fatigue life prediction problem of a multi-chip assembly welding spot under a thermal cycle load as a starting point, a probability failure physical modeling frame is analyzed and constructed; a strategy of step-by-step implementation of all key steps is elaborated in details and a strategy of carrying out fusion of life data measured by the test by using the Bayesian theory is explained emphatically, and then a Bayesian information update frame is built. Fitting is carried out based on prior distribution of key parameter uncertainty in an obtained model and the obtained welding spot prior life distribution becomes wide and deviation to a practical measurement value occurs; under the framework of the Bayesian theory, fusion with practically measured data of thermal cycling is carried out and thus centralized welding spot posterior life distribution matching the practical situa